Reconstructions of the Ge(0 0 1) surface

We have performed dipole calculations of energies of the Ge(0 0 1) surface to compare the ground states of b(2 × 1), c(4 × 2), p(2 × 2) and p(4 × 1) symmetry dimer reconstructions. We have found that p(2 × 2) is the lowest energy reconstruction at zero temperature

Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology

Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as consequence of the differences in their manufacturing processes e.g. different etching times. We have made simulations examining how the etching quality reflects in the thermal behaviour of devices. These simulations predicted change in the thermal behaviour of MEMS structures having differences in their sacrificial layers. The theory was tested with measurements of similar MEMS devices prepared with different etching times. In the measurements we used the T3Ster thermal transient tester equipment. The results show that deviations in the devices, as consequence of the different etching times, result in different temperature elevations and manifest also as shift in time in the relevant temperature transient curves.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Thermal measurement and modeling of multi-die packages

Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show results for a mixed arrangement: an opto-coupler device has been investigated with 4 chips in lateral as well as vertical arrangement. In this paper we give an overview of measurement and modeling techniques and results for stacked and MCM structures, describe our present measurement results together with our structure function based methodology of validating the detailed model of the package being studied. Also, we show how to derive junction-to-pin thermal resistances with a technique using structure functions.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

A Novel Protocol-Authentication Algorithm Ruling Out a Man-in-the-Middle Attack in Quantum Cryptography

In this work we review the security vulnerability of Quantum Cryptography with respect to "man-in-the-middle attacks" and the standard authentication methods applied to counteract these attacks. We further propose a modified authentication algorithm which features higher efficiency with respect to consumption of mutual secret bits.Comment: 4 pages, submitted to the International Journal of Quantum Information, Proceedings of the meeting "Foundations of Quantum Information", Camerino, April 200